Abl Heatsinks (BGA-STD-015) Heat Sink, For Ball Grid Array, Standard

Heat Sink, For Ball Grid Array, Standard, 26.5 °C/W, BGA, 14 mm, 10 mm, 14 mm Product Information Thermal Resistance: 26.5°C/W Packages Cooled: BGA External Width - Metric: 14mm External Height - Metric: 10mm External Length - Metric: 14mm Heat Sink Material: Aluminium External Width - Imperial: 0.55" External Height - Imperial: 0.39" External Length - Imperial: 0.55" Product Overview The BGA-STD-015 is a 14mm standard Heat Sink with aluminium, black anodized, thermal tape, 26.5°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces. 0.27mm Thickness Applications HVAC