Multicomp Pro (MC001808) Breadboard - 750 Tie Points - 8.3 mm - 99 mm - 82.1 mm
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  • Multicomp Pro (MC001808) Breadboard - 750 Tie Points - 8.3 mm - 99 mm - 82.1 mm

Multicomp Pro (MC001808) Breadboard - 750 Tie Points - 8.3 mm - 99 mm - 82.1 mm

R302.98
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Multicomp Pro (MC001808) Breadboard, 750 Tie Points, 8.3 mm, 99 mm, 82.1 mm

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Product Information: Breadboard Type: Solderless Breadboard Total Number of Tie Points: 750Tie Points No. of Distribution Strips / Buses: 3Bus Strips No. of Terminal Strips: 2 Terminal Strips Board Dimensions (L x W) - Imperial: 3.23" x 3.89" Board Dimensions (L x W) - Metric: 82mm x 99mm Product Overview: Great value and wide range of prototyping breadboards. Get prototyping your design with our range of solderless breadboards from Multicomp. Available in various sizes and configurations Pitch spacing is 2.54mm Two terminal strip with 600 tie-points and three distribution strips with 150 tie-points Rated voltage is 300V Rated current is 3A to 5A Insulation resistance is 500Mohm at 500VDC Withstanding voltage is 1000VAC 1min Wire size range from 29AWG to 20AWG Temperature range from -25°C to +80°C 7mm to 8mm strip length, dimension of the board is 99mm x 82.1mm (L x W)

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