Multicomp Pro (MC001795) Breadboard - 830 Tie Points - 8.3 mm - 56 mm - 165 mm

Product Information: Breadboard Type: Solderless Breadboard Total Number of Tie Points: 830Tie Points No. of Distribution Strips / Buses: 2Bus Strips No. of Terminal Strips: 1 Terminal Strip Board Dimensions (L x W) - Imperial: 6.5" x 2.2" Board Dimensions (L x W) - Metric: 165mm x 56mm Product Overview: Great value and wide range of prototyping breadboards. Get prototyping your design with our range of solderless breadboards from Multicomp. Available in various sizes and configurations Pitch spacing is 2.54mm One terminal strip with 630 tie-points, one distribution strip with 200 tie-points Rated voltage is 300V Rated current is 3A to 5A Insulation resistance is 500Mohm at 500VDC Withstanding voltage is 1000VAC 1min Wire size range from 29AWG to 20AWG Temperature range from -25°C to +80°C 7mm to 8mm strip length, dimension of the board is 165.1mm x 56mm (L x W)