Roth Elektronik (RE943-S3) Breadboard Solderable Epoxy Fibreglass

Product Information: Board Type: Solderable Breadboard Board Material: Epoxy Fibreglass Hole Diameter: 1.1mm External Height: 57.78mm External Width: 46.99mm Board Thickness: 1.5mm Product Overview: The RE943-S3 is a 46.99 x 57.78mm solderable Breadboard, made of 1.5mm fibreglass and 35µm Cu double-sided construction with solder stop mask and plated through holes. This hot air levelling adaption circuit board features U-shape potential strip, 12 x 16 2.2mm Ø solder pads with 2.54mm grid, 8 three-hole-pads and 2 x 8 two-hole-pads on each side. This adaption circuit board suits for 16-pin sockets with a 7.62mm distance. 2.54mm Hole spacing Lead-free hot air levelling Applications: Industrial