Microchip (ATWINC3400-MR210CA122) Bluetooth 4.0, Class 1, Class 2 Module

Bluetooth 4.0, Class 1, Class 2 Module, 2.5V to 4.2V Supply, 72Mbps, -90 dB Sensitivity, 2.4GHz Product Information Bluetooth Version: Bluetooth 4.0 Supply Voltage Min: 2.5V Supply Voltage Max: 4.2V Signal Range Max: - Data Rate: 72Mbps Bluetooth Class: Class 1, Class 2 Receive Sensitivity: -90dB Operating Temperature Min: -40°C Operating Temperature Max: 85°C Product Range: ATWINC3400 Series The ATWINC3400-MR210CA is an IEEE 802.11 b/g/n RF/Baseband/Medium Access Control (MAC) network controller module with Bluetooth Low Energy technology that is compliant with Bluetooth version 4.0. This module is optimized for low power and high performance mobile applications. This module features small form factor when integrating Power Amplifier (PA), Low-Noise Amplifier (LNA), Transmit/ Receive (T/R) switch (for Wi-Fi® and Bluetooth), Power Management Unit (PMU), and Chip Antenna. The ATWINC3400-MR210CA module requires a 32.768 kHz clock for Sleep operation. The ATWINC3400-MR210CA module utilizes highly optimized IEEE 802.11 Bluetooth coexistence protocols, and provides Serial Peripheral Interface (SPI) to interface with the host controller. Wi-Fi features: • IEEE 802.11 b/g/n RF/PHY/MAC • IEEE 802.11 b/g/n (1x1) with single spatial stream, up to 72 Mbps PHY rate in 2.4 GHz ISM band • Integrated chip antenna • Superior sensitivity and range via advanced PHY signal processing • Advanced equalization and channel estimation • Advanced carrier and timing synchronization • Supports Soft-AP • Supports IEEE 802.11 WEP, WPA, and WPA2 • Superior MAC throughput through hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgment • On-chip memory management engine to reduce the host load • Operating temperature range from -40°C to +85°C • Wi-Fi Alliance certified for connectivity and optimizations – ID: WFA62065 • Integrated on-chip microcontroller • SPI host interface • Integrated Flash memory for Wi-Fi and Bluetooth system software • Low leakage on-chip memory for state variables • Fast AP re-association (150 ms) • On-chip network stack to offload MCU – Integrated network IP slack to minimize the host CPU requirements