Boyd (374324B00035G) Heat Sink, Square, PCB, 30.6 °C/W

Heat Sink, Square, PCB, For Ball Grid Arrays, 30.6 °C/W, BGA, 27 mm, 10 mm, 27 mm Product Information Thermal Resistance: 30.6°C/W Packages Cooled: BGA External Width - Metric: 27mm External Height - Metric: 10mm External Length - Metric: 27mm Heat Sink Material: Aluminium External Width - Imperial: 1.06" External Height - Imperial: 0.39" External Length - Imperial: 1.06" Product Overview Tape mounting saves board space by eliminating mounting holes Convenient peel and stick assembly is quick and clean Pin-Fin array allows omni-directional airflow to maximize heat dissipation Fin dimensions (LxW): 13x12mm