Fischer Elektronik (ICK BGA 10 X 10 X 10) Heat Sink, Square, PCB, 28.5 °C/W

Heat Sink, Square, PCB, For Ball Grid Arrays, 28.5 °C/W, BGA, 10 mm, 10 mm, 10 mm Product Information Thermal Resistance: 28.5°C/W Packages Cooled: BGA External Width - Metric: 10mm External Height - Metric: 10mm External Length - Metric: 10mm Heat Sink Material: Aluminium External Width - Imperial: 0.39" External Height - Imperial: 0.39" External Length - Imperial: 0.39" Product Overview The ICK BGA 10 X 10 X 10 is a 10mm Heat Sink with aluminium, black anodised, universal socket, pins, square, 28.5 to 8.1K/W thermal resistance. Suitable for universal processor and IC design BGAs. 1.9W Dissipation loss Applications HVAC