Wakefield Thermal (637-10ABEP) Heat Sink, 5.8 °C/W, TO-220

Heat Sink, For Board Level Power Semiconductor, 5.8 °C/W, TO-220, 34.9 mm, 25.4 mm, 12.7 mm Product Information Thermal Resistance: 5.8°C/W Packages Cooled: TO-220 External Width - Metric: 34.9mm External Height - Metric: 25.4mm External Length - Metric: 12.7mm Heat Sink Material: Aluminium External Width - Imperial: 1.37" External Height - Imperial: 1" External Length - Imperial: 0.5" Product Overview The 637-10ABEP is a 12.7mm power semiconductor Heat Sink with aluminium construction, black anodized finish, 5.8°C/W thermal resistance. This heat sink features wave-solderable pins on 1-inch centres for vertical mounting on printed circuit boards. Use this heat sink where weight and board space occupied is minimized. High efficiency Board level Applications HVAC