Boyd (3.5Y-1) Heat Sink, PCB, Board Level, 3.4 °C/W
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  • Boyd (3.5Y-1) Heat Sink, PCB, Board Level, 3.4 °C/W

Boyd (3.5Y-1) Heat Sink, PCB, Board Level, 3.4 °C/W

R783.59
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Boyd (3.5Y-1) Heat Sink, PCB, Board Level, 3.4 °C/W

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Heat Sink, PCB, Board Level, 3.4 °C/W, TO-66, 60 mm, 16 mm, 89 mm Product Information Thermal Resistance: 3.4°C/W Packages Cooled: TO-66 External Width - Metric: 60mm External Height - Metric: 16mm External Length - Metric: 89mm Heat Sink Material: Aluminium External Width - Imperial: 2.36" External Height - Imperial: 0.63" External Length - Imperial: 3.5" Product Overview The 3.5Y-1 is a PC board Heat Sink made of aluminium for use with TO-66 packages. Applications HVAC, Thermal Management

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