Fischer Elektronik (ICK BGA 14 X 14 X 10) Heat Sink, 27.4 °C/W

Heat Sink, Square, PCB, For Ball Grid Arrays, 27.4 °C/W, BGA, 14 mm, 10 mm, 14 mm Product Information Thermal Resistance: 27.4°C/W Packages Cooled: BGA External Width - Metric: 14mm External Height - Metric: 10mm External Length - Metric: 14mm Heat Sink Material: Aluminium External Width - Imperial: 0.55" External Height - Imperial: 0.39" External Length - Imperial: 0.55" Product Overview The ICK BGA 14 X 14 X 10 is a 14 x 14 x 10mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors. 1.8mm Plate thickness Applications Industrial