Cci (CCI02)Heat Sink, BGA, FPGAs, Double Sided Adhesive, 7.93 °C/W, BGA

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 7.93 °C/W, BGA, 45 mm, 10 mm, 45 mm Product Information Thermal Resistance: 7.93°C/W Packages Cooled: BGA External Width - Metric: 45mm External Height - Metric: 10mm External Length - Metric: 45mm Heat Sink Material: Aluminium External Width - Imperial: 1.77" External Height - Imperial: 0.39" External Length - Imperial: 1.77" Product Overview The CCI02 is a Heat Sink made of aluminium typically used with DSP, FPGAs and other electronics BGA packages. It is also suitable for variety of applications requiring simple extension of surface area for cooling. The double sided adhesive provides simple and effective attachment. Applications HVAC, Thermal Management