Wakefield Thermal (647-10-ABEP) Heat Sink, 3.8 °C/W, TO-220

Heat Sink, For Board Level Power Semiconductor, 3.8 °C/W, TO-220, 41.9 mm, 25.4 mm, 25.4 mm Product Information Thermal Resistance: 3.8°C/W Packages Cooled: TO-220 External Width - Metric: 41.9mm External Height - Metric: 25.4mm External Length - Metric: 25.4mm Heat Sink Material: Aluminium External Width - Imperial: 1.65" External Height - Imperial: 1" External Length - Imperial: 1" Product Overview The 647-10-ABEP is a 25.4mm high-performance board level power semiconductor Heat Sink with aluminium, black anodized, 3.8°C/W thermal resistance. This heat sink features wave-solderable pins on 1-inch centres for vertical mounting of larger devices on printed circuit boards. Applications HVAC