Wakefield Solutions (637-15ABEP) Heat Sink, 11 °C/W, TO-220

Heat Sink, For Board Level Power Semiconductor, 11 °C/W, TO-220, 34.9 mm, 38.1 mm, 12.7 mm Product Information Thermal Resistance: 11°C/W Packages Cooled: TO-220 External Width - Metric: 34.9mm External Height - Metric: 38.1mm External Length - Metric: 12.7mm Heat Sink Material: Aluminium External Width - Imperial: 1.37" External Height - Imperial: 1.5" External Length - Imperial: 0.5" Product Overview The 637-15ABEP is a 38.1 x 34.9 x 12.7mm high-efficiency Heat Sink made of aluminium with black anodized finish. This board level heat sink features wave-solderable pins on 1-inch centre for vertical mounting on printed circuit boards. Use this heat sink where weight and board space occupied must be minimized. Applications Industrial