Boyd (374024B00035G) Heat Sink, Square, PCB, For Ball Grid Arrays, 40 °C/W

Heat Sink, Square, PCB, For Ball Grid Arrays, 40 °C/W, BGA, 23 mm, 10 mm, 23 mm Product Information Thermal Resistance: 40°C/W Packages Cooled: BGA External Width - Metric: 23mm External Height - Metric: 10mm External Length - Metric: 23mm Heat Sink Material: Aluminium External Width - Imperial: 0.91" External Height - Imperial: 0.39" External Length - Imperial: 0.91" Product Overview The 374024B00035G is a 10 x 23 x 23mm pin fin Heat Sink with tape attachment. This heat sink is made of aluminium and due its tape mounting it saves board space by eliminating mounting holes, convenient peel and stick assembly is quick and clean. The pin fin array allows omnidirectional airflow to maximize heat dissipation. Applications Industrial, Consumer Electronics