Boyd (MQ75-1) Heat Sink, PCB, Board Level, 7.5 °C/W, TO-218, TO-220

Heat Sink, PCB, Board Level, 7.5 °C/W, TO-218, TO-220, 29.5 mm, 11 mm, 75 mm Product Information Thermal Resistance: 7.5°C/W Packages Cooled: TO-218, TO-220 External Width - Metric: 29.5mm External Height - Metric: 11mm External Length - Metric: 75mm Heat Sink Material: Aluminium External Width - Imperial: 1.16" External Height - Imperial: 0.43" External Length - Imperial: 2.95" Product Overview The MQ75-1 is a 75 x 29.5 x 11mm undrilled power Heat Sink made of aluminium with black anodized finish. This heat sink is suitable for use with TO-218 and TO-220 devices. Applications Industrial